2020
V. Hessel, J. Nijhuis, Q.-D. Tran, T. Dinh, H.-P. Phan, N.-T. Nguyen, T.T. Tran, D. Losic, N.N. Tran, Toward on-board Microchip Synthesis of CdSe vs PbSe Nanocrystalline Quantum Dots as a Spectral Decoy for Protecting Space Assets, React. Chem. Eng, 2020. Accepted. (IF: 3.441)
T.A. Pham, L. Hold, A. lacopi, T.-K. Nguyen, H.H. Cheng, T. Dinh, D.V. Dao, H.T. Ta, N.-T. Nguyen, H.-P. Phan, Wet oxidation of 3C-SiC on Si for MEMS processing and use in harsh environments: Effects of the film thicknesses, crystalline orientations, and growth temperatures, Sensors & Actuators A: Physics, 2020. Accepted. (IF: 2.904)
A.R. Md Foisal, A. Qamar, T. Nguyen, T. Dinh, H.-P. Phan, H. Nguyen, P.G. Duran, E.W. Streed, D.V. Dao, Ultra-sensitive self-powered position-sensitive detector based on horizontally-aligned double 3C-SiC/Si heterostructures, Nano Energy, 2020. (IF: 16.602)
C.-D. Tran, H.P. Pham, T. X. Dinh, T.-K. Nguyen, H.-P. Phan, T. Dinh, T. Nguyen, T.T. Bui, D.T. Chu, N.-T. Nguyen, D.V. Dao, V.T. Dau, A new structure of Tesla coupled nozzle in synthetic jet micro-pump, Sensors and Actuators A: Physical, 2020. (IF: 2.904)
T.-A. Pham, A. Qamar, T. Dinh, M.K. Masud, M. Rais-Zadeh, D.G. Senesky, Y. Yamauchi, N.-T. Nguyen, and H.-P. Phan, Nanoarchitectonics for wide band gap semiconductor nanowires: Toward the next generation of nanoelectromechanical systems for environmental monitoring, Advanced Science, 2020. (IF: 15.840)
T. Dinh*, T. Nguyen, H.-P. Phan, N.-T. Nguyen, D.V. Dao, J. Bell, Stretchable respiration sensors: advanced designs and multifunctional platforms for wearable physiological monitoring, Biosensors and Bioelectronics, 2020. (IF: 10.257) pdf
T.-A. Pham, T.-K. Nguyen, R.K. Vadivelu, T. Dinh, A. Qamar, S. Yadav, Y. Yamauchi, J.A. Rogers, N.-T. Nguyen, and H.-P. Phan, A Versatile Sacrificial Layer for Transfer Printing of Wide Bandgap Materials for Implantable and Stretchable Bioelectronics, Advanced Functional Materials, 2020. (IF: 15.621, Nature Indexed)
P. Guzman, T. Dinh, H.-P. Phan, A. P. Joy, A. Qamar, B. Bahreyni, Y. Zhu, M. Rais-Zadeh, H. Li, N.-T. Nguyen, D. V. Dao, Highly-doped SiC resonator with ultra-large tuning frequency range by Joule heating effect, Materials & Design, 2020 (IF: 5.77)
T. Nguyen*, T. Dinh*, H.-P. Phan, V. T. Dau, T.-K. Nguyen, A. P. Joy, B. Bahreyni, A. Qamar, M. Rais-Zadeh, D. G. Senesky, N.-T. Nguyen and D. V. Dao, Self-Powered Monolithic Accelerometer Using A Photonic Gate, Nano Energy, 2020, (IF: 15.548)
A. Qamar, H.-P. Phan, T. Dinh, N-.T Nguyen, M. Rais-Zadeh, ScAlN/3C-SiC/Si platform for monolithic integration of highly sensitive piezoelectric and piezoresistive devices, Applied Physics Letters, 2020 (IF: 3.521, Nature Indexed)
T. Dinh*, T. Nguyen, A. R. M. Foisal, H.-P. Phan, T.-K. Nguyen, N.-T. Nguyen, and D. Dao, Optothermotronic effect as an ultrasensitive thermal sensing technology for solid-state electronics, Science Advances, 2020 (IF: 12.804, Nature Indexed)
H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Qamar, T. Nguyen, V. T. Dau, J. Han, D. V. Dao, N.-T. Nguyen, High temperature silicon-carbide-based flexible electronics for monitoring hazardous environments, Journal of Hazardous Materials, 2020, (IF: 7.650)
T. Nguyen, T. Dinh, H.-P. Phan, T.-K. Nguyen, A. R. Md Foisal, N.-T. Nguyen, and D. V. Dao, Opto-electronic coupling in semiconductors: towards ultrasensitive pressure sensing, Journal of Materials Chemistry C, 2020 (IF: 6.641 )
T.-K. Nguyen, H.-P. Phan, K.M. Dowling, A. S. Yalamarthy, T. Dinh, V. Balakrishnan, T. Liu, C.A. Chapin, Q.-D. Truong, V.T. Dau, K.E. Goodson, D.G. Senesky, D.V. Dao, and N.-T. Nguyen, Lithography and etching-free microfabrication of silicon carbide on insulator using direct UV laser ablation, Adv. Eng. Mater., 2020. Accepted (IF: 2.906 )
T. Dinh*, T. Nguyen, H.-P. Phan, T.-K. Nguyen, V. T. Dau, N.-T. Nguyen, D. V. Dao, Advances in rational designs and materials of high-performance stretchable electromechanical sensors, Small, 2020 (IF: 10.856)
2019
A.R. Md Foisal, T.Nguyen, T. Dinh, T-K Nguyen, P. Tanner, E. Streed, D.V. Dao, 3C-SiC/Si heterostructure: an excellent platform for position sensitive detectors based on photovoltaic effect, ACS Applied Materials & Interfaces, accepted, 2019 (IF: 8.456 )
V. Balakrishnan, T. Dinh, A.R. Md Foisal, T. Nguyen, H.-P. Phan, D.V. Dao, and N.-T. Nguyen, Paper-based electronics using Graphite and Silver nanoparticles for respiration monitoring, IEEE Sensor Journal, 2019. Accepted (IF: 3.076, Q1)
H.-P. Phan, Y. Zhong, T.-K. Nguyen, Y. Park, T. Dinh, E. Song, R.K. Vadivelu, M. K. Masud, J. Li, M.J.A. Shiddiky, D. Dao, Y. Yamauchi, J. A. Rogers, and N.-T. Nguyen, Long-lived, transferred crystalline silicon carbide nanomembranes for implantable flexible electronics, ACS Nano, 2019. Accepted (IF: 13.903,Q1, Nature Indexed)
T. Nguyen*, T. Dinh*, A. R. M. Foisal, H.-P. Phan, T.-K. Nguyen, N.-T. Nguyen, and D. Dao*, Giant piezoresistive effect by optoelectronic coupling in a heterojunction, Nature communications, Accepted (IF: 11.88, Q1, Nature Indexed)
G. Shi, S. E. Lowe, A. J. Teo, T. K. Dinh, S. H. Tan, J. Qin, et al., A versatile PDMS submicrobead/graphene oxide nanocomposite ink for the direct ink writing of wearable micron-scale tactile sensors, Applied Materials Today, vol. 16, pp. 482-492, 2019. (IF: 8.013, Q1)
H.-P. Phan, M. K. Masud, R. K. Vadivelu, T.Dinh, T.-K Nguyen, K. Ngo,D. Dao, M. Shiddiky, M. Hossain, Y. Yamauchi, N.-T. Nguyen, Transparent crystalline cubic SiC-on-glass electrodes enable simultaneous electrochemistry and optical microscopy, Chemical Communications, Accepted (IF: 6.290, Q1, Nature Indexed)
J. Fastier-Wooller, T. Dinh, V. Dau, D. V. Dao, Soft Ionic Liquid Multi-Point Touch Sensor, RSC Advances, 3/2019, Accepted. (IF: 2.936, Q1)
T. Dinh, V. Dau, C.-D. Tran, T. K. Nguyen, H.-P. Phan, N.-T. Nguyen, and D. V. Dao, Polyacrylonitrile-carbon nanotube-polyacrylonitrile: a versatile robust platform for flexible multifunctional electronic devices in medical applications, Macromolecular Materials and Engineering, 2019, Accepted. (IF: 2.69, Q1)
A. R. Md Foisal, T. Dinh, T. Nguyen, P. Tanner, H.-P. Phan, K. N. Tuan, B. Haylock, E. W. Streed, and D. V. Dao, Self-powered broadband (UV-NIR) photodetector based on 3C-SiC/Si heterojunction, IEEE Transactions on Electron Devices, 2019, Accepted. (IF: 2.62, Q1)
H.-P. Phan, T.-K. Nguyen, T. Dinh, A. Qamar, A. Iacopi, J. Lu, D.V. Dao, M. Rais-Zadeh, and N.-T. Nguyen, Wireless battery-free SiC sensors operating in harsh environments using resonant inductive coupling, IEEE Electron Device Lett., 2019, Accepted. (IF: 3.433, Q1)
H. Q. Nguyen, H. A. Moghadam, T. Dinh, H.-P. Phan, T.-K. Nguyen, J. Han, N.-T. Nguyen, and D.V. Dao, Dependence of offset voltage in AlGaN/GaN van der Pauw devices under mechanical strain, Mater. Lett., 2019, Accepted. (IF: 2.687)
V. Balakrishnan, T. Dinh, T. Nguyen, H.-P. Phan, T.-K. Nguyen, D. V. Dao and N.-T. Nguyen, A hot-film air flow sensor for elevated temperatures, Review of Scientific Instruments, 2019, Accepted, (IF: 1.428)
2018
T. Dinh, T.-K. Nguyen, H.-P. Phan, Q. Nguyen, J. Han, S. Dimitrijev, N.-T. Nguyen, D. V. Dao, Thermoresistance of p-type 4H-SiC integrated MEMS devices for high-temperature sensing, Advanced Engineering Materials, 2018, Accepted, (IF: 2.576 )
J. Fastier-Wooller, T. Dinh, V. Dau, H.-P. Phan, F. Yang, D. V. Dao, Low-Cost Graphite on Paper Pressure Sensor for Robot Gripper with a Trivial Fabrication Process, Sensors, 2018, Accepted (IF: 2.475)
H.-P. Phan, K.M. Dowling, T.-K. Nguyen, C.A. Chapin, T. Dinh, R.A. Miller, J. Han, A. Iacopi, D.G. Senesky, D.V. Dao, and N.-T. Nguyen, Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures, RSC Adv., 2018, Accepted (IF: 2.936)
T.-K. Nguyen, H.-P. Phan, T. Dinh, A.R. Md Foisal, N.-T. Nguyen, and D.V. Dao, High-temperature tolerance of piezoresistive effect in p-4H-SiC for harsh environment sensing, J. Mater. Chem. C, 2018, Accepted. (IF: 5.976)
T. Dinh, H.-P. Phan, N. Kashaninejad, T.-K. Nguyen, D.V. Dao, N.-T. Nguyen, An on-chip SiC MEMS device with integrated heating, sensing and microfluidic cooling systems, Advanced Materials Interfaces, 2018, Accepted. (IF: 4.834)
T.-K. Nguyen, H.-P. Phan, T. Dinh, K.M. Dowling, A.R. Md Foisal, D.G. Senesky, N.-T. Nguyen, and D.V. Dao, Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures, Materials & Design., 2018, Accepted. (IF: 4.525)
H.-P. Phan, T.-K. Nguyen, T. Dinh, H.H. Cheng, F. Mu, A. Iacopi, L. Hold, T. Suga, D.V. Dao, D.G. Senesky, and N.-T. Nguyen, Strain effect in highly doped n-type 3C-SiC-on-glass substrate for mechanical sensors and mobility enhancement, Phys. Sta. Sol. A., 2018. Accepted (IF: 1.775)
A.R. Md. Foisal, T. Dinh, P. Tanner, H.-P. Phan, T. -K. Nguyen, E. Streed, D. V. Dao, Photoresponse of a highly-rectifying 3C-SiC/Si heterostructure under UV and visible illuminations, IEEE Electron Device Lett., 2018. Accepted. (IF: 3.048)
A. Vatani, P. Woodfield, T. Dinh, H.-P. Phan, N.-T. Nguyen, D. V. Dao, Degraded boiling heat transfer from hotwire in ferrofluid due to particle deposition, Applied Thermal Engineering, 2018. Accepted. (IF: 3.444)
T.-K. Nguyen, H.-P. Phan, T. Dinh, T. Toriyama, K. Nakamura, R.A. Md Foisal, N.-T. Nguyen, D.V. Dao, Isotropic piezoresistance of p-type 4H-SiC in (0001) plane, Applied Physics Letters, 2018. Accepted. (IF: 3.411)
H.-P. Phan, Karen M. Dowling, T.-K. Nguyen, T. Dinh, D.G. Senesky, T. Namazu, D.V. Dao, and N.-T. Nguyen, Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure, Materials & Design, 2018. Accepted. (IF: 4.364)
V. Balakrishnan, T. Dinh, H.-P. Phan, D.V. Dao, and N.-T. Nguyen, Highly Sensitive 3C-SiC on glass based thermal flow sensor realized using MEMS technology, Sensors & Actuators A: Physical, 2018. Accepted. (IF: 2.499)
A.R. Md. Foisal, H.-P. Phan, T. Dinh, T.-K. Nguyen, N.-T. Nguyen, and D.V. Dao, A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding, RSC Advances, Accepted, 2018. (IF: 3.048)
T. Dinh, H.-P. Phan, T.-K. Nguyen, V. Balakrishnan, H.-H. Cheng, L. Hold, A. Lacopi, N.-T. Nguyen, and D.V. Dao, Unintentionally doped epitaxial 3C-SiC(111) nanothin film as material for highly sensitive thermal sensors at high temperatures, IEEE Electron Device Lett., Accepted, 2018. (IF: 3.048)
T. Dinh, T.-K. Nguyen, H.-P. Phan, F.-W. Jarred, C. D. Tran, N.-T. Nguyen, and D.V. Dao, Electrical resistance of carbon nanotube yarns under compressive transverse pressure, IEEE Electron Device Lett., Accepted, 2018. (IF: 3.048)
T.-K. Nguyen, H.-P. Phan, J, Han, T. Dinh, A. R. M. Foisal, S. Dimitrijev, Y. Zhu, N.-T. Nguyen, and D.V. Dao, Highly sensitive p-type 4H-SiC Van der Pauw sensor, RSC Advances, Accepted, 2018. (IF: 3.108)
2017
H.-P. Phan, T.-K. Nguyen, T. Dinh, A. Iacopi, L. Hold, M. J. A. Shiddiky, D. V. Dao, and N.-T. Nguyen, Robust free-standing nano-thin SiC membranes enable direct photolithography for MEMS sensing applications, Adv. Eng. Mater., 2017, accepted. (IF= 2.319)
T.-K. Nguyen, H.-P. Phan, H. Kamble, R. Vadivelu, T. Dinh, A. Iacopi, G. Walker, L. Hold, N.-T. Nguyen, D.V. Dao, Ultra-thin single crystalline SiC membrane as a versatile platform for biological applications, ACS Appl. Mater. Interfaces, 2017, accepted, (IF= 7.504)
A.R. Md Foisal, A. Qamar, H-P Phan, T. Dinh, T-K Nguyen, P. Tanner, E. Streed, D.V. Dao, Pushing the limits of piezoresistive effect by opto-mechanical coupling in 3C-SiC/Si heterostructure, ACS Applied Materials & Interfaces, accepted, 11/2017 (IF= 7.504)
A. Qamar, T. Dinh, M. Jafari, A. Lacopi, S. Dimitrijev, D. V. Dao, A large pseudo-Hall effect in n-type 3C-SiC(100) and its dependence on crystallographic orientation for stress sensing applications, Materials Letters, 10/2017. accepted (IF=2.572)
V. Balakrishnan, T. Dinh, H.-P. Phan, D.V. Dao, and N.-T. Nguyen, Generalised analytical model for Joule heating of segmented wires, ASME J. Heat Transfer, 10/2017, accepted. (IF= 1.866)
V. Balakrishnan, H.-P. Phan, T. Dinh, D. V. Dao, N.-T. Nguyen, Thermal flow sensors for harsh environments, Sensors, accepted, 9/2017 (IF= 2.677)
H.-P. Phan, H.H. Cheng, T. Dinh, B. Wood, T.-K. Nguyen, F. Mu, H. Kamble, R. Vadivelu, G. Walker, L. Hold, A. Iacopi, B. Haylock, D.V. Dao; M. Lobino, T. Suga, and N.-T. Nguyen, Single crystalline 3C-SiC anodically bonded onto glass: an excellent platform for high temperature electronics and bio applications, ACS Appl. Mater. Interfaces, accepted, 8/2017 (IF=7.504)
T.-K. Nguyen, T. Dinh, H.-P. Phan, C.D. Tran, A. R. Md. Foisal, Y. Zhu, and D.V. Dao, Electrically Stable Carbon Nanotube Yarn Under Tensile Strain, IEEE Electron Device Lett., accepted, 7/2017 (IF= 3.032)
T. Dinh, H. P. Phan, A. Qamar, P. Woodfield, N. T. Nguyen, D. V. Dao, Thermoresistive effect for advanced thermal sensors: fundamentals, design considerations and applications, IEEE Journal of Microelectromechanical Systems (JMEMS), accepted, 5/2017 (IF=1.939 )
V. Balakrishnan, T. Dinh, H.-P. Phan, T. Kozeki, T. Namazu , D.V. Dao, N. T. Nguyen, Steady-state analytical model of suspended p-type 3C-SiC bridges under consideration of Joule-heating, J. Micromech. Microeng., 2017, Accepted, 5/2017 (IF=1.768)
T.-K. Nguyen, H.-P. Phan, T. Dinh, J. Han, S. Dimitrijev, P. Tanner, A. R. Md Foisal, Y. Zhu, N.-T. Nguyen, and D.V. Dao, Experimental Investigation of Piezoresistive Effect in p-type 4H-SiC, IEEE Electron Device Lett., Accepted, 4/2017 (IF=2.528) PDF
Toan Dinh, H.-P. Phan, T.-K. Nguyen, A. Qamar, P. Woodfield, Y. Zhu, N.-T. Nguyen, and D.V. Dao, Solvent-Free Fabrication of Biodegradable Hot-Film Flow Sensor for Noninvasive Respiratory Monitoring, J. Phys. D: Appl. Phys., Accepted, 4/2017 (IF=2.772)
A. Qamar, D.V. Dao, J. Han, A. Iacopi, T. Dinh, H.-P. Phan, and S. Dimitrijev, Piezo-Hall effect and fundamental piezo-Hall coefficients of single crystal n-type 3C-SiC(100) with low carrier concentration, Appl. Phys. Lett., 110(16), 162903, 2017. (IF=3.142)
H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Vatani, A. R. Md Foisal, A. Qamar, A. R. Kermany, D. V. Dao, and N.-T. Nguyen, Self-sensing paper-based actuators employing ferromagnetic nanoparticles and graphite, Appl. Phys. Lett., 110, 144101, 2017. (IF=3.142)
H.-P. Phan, G. Ina, T. Dinh, T. Kozeki, T.-K. Nguyen, T. Namazu, A. Qamar, D. V. Dao, and N.-T. Nguyen, Formation of silicon carbide nanowire on insulator through direct wet oxidation, Materials Letters, 196, 280-283, 2017. (IF=2.437)
H.-P. Phan, T.-K. Nguyen, T. Dinh, G. Ina, A. R. Kermany, A. Qamar, J. Han, T. Namazu, R. Maeda, D. V. Dao, and N.-T. Nguyen, Ultra-high strain in epitaxial silicon carbide nanostructures utilizing residual stress amplification, Appl. Phys. Letts., 110, 141906, 2017. (IF=3.142) (Editor’s pick in vol. 110, issue. 14)
2016
T. Dinh, H.-P. Phan, T.-K. Nguyen, A. Qamar, A. R. M. Foisal, N. V. Thanh, C.-D. Tran, Y. Zhu, N.-T. Nguyen and D. V. Dao, Environment-friendly carbon nanotube based flexible electronics for noninvasive and wearable healthcare, J. Mater. Chem. C, 4, 10061-10068, 2016. (IF=5.066)
H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen and D. V. Dao, Nano strain-amplifier: making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects, Appl. Phys. Lett., 109, p. 123502, 2016. (IF=3.142) (Editor’s pick in vol. 109, issue. 13)
A. R. M. Foisal, H.-P. Phan, T. Kozeki, T. Dinh, T.-K. Nguyen, A. Qamar, M. Lobino, T. Namazu, and D. V. Dao, 3C-SiC on glass: an ideal platform for temperature sensors under visible light illumination, RSC Adv., 2016, Accepted. (IF=3.29)
A. Qamar, D. V. Dao, H.-P. Phan, T. Dinh, and S. Dimitrijev, Fundamental piezo-Hall coefficients of single crystal p-type 3C-SiC for arbitrary crystallographic orientation, Appl. Phys. Lett., vol. 109, p. 092903, 2016. (IF=3.142)
F.-W. Jarred, H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Cameron, A. Ochsner, and D. V. Dao, Novel low-cost sensor for human bite force measurement, Sensors J., vol. 16, no. 8, pp. 1244 (1-10), 2016. (IF=2.033)
T. Dinh, H.-P. Phan, A. Qamar, N.-T. Nguyen, and D. V. Dao, Flexible and multifunctional electronics fabricated by a solvent-free and user-friendly method, RSC Adv., vol. 6, no. 81, pp. 77267-77274, 2016. (IF=3.29)
H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen, and D. V. Dao, The piezoresistive effect in top-down fabricated p-type 3C-SiC nanowires, IEEE Electron Device Lett., vol. 37, no.8, pp. 1029-1302, 2016 (IF=2.75)
H.-P. Phan, T. Dinh, T. Kozeki, A. Qamar, T. Namazu, S. Dimitrijev, N.-T. Nguyen, and D. V. Dao, Piezoresistive effect in p-type 3C-SiC at high temperatures characterized using Joule heating, Scie. Rep., vol. 6, pp. 28499 (1-10), 2016. (IF= 5.58)
T. Dinh, H.-P. Phan, T. Kozeki, A. Qamar, T. Fujii, T. Namazu, N.-T. Nguyen, and D. V. Dao, High thermoresistivity of silicon nanowires induced by amorphization, Mater. Lett., vol. 117, pp. 80-84, 2016. (IF=2.5)
A. Qamar, H.-P. Phan, T. Dinh, L. Wang, S. Dimitrijev, and D. V. Dao, Piezo-Hall effect in 3C-SiC (100) thin film grown by low pressure chemical vapor deposition, RSC Adv., vol. 6, pp. 31191-31195, 2016. (IF=3.84)
D. V. Dao, H.-P. Phan, A. Qamar, and T. Dinh, Piezoresistive effect of single crystalline 3C-SiC on (111) plane, RSC Adv., vol. 6, pp. 21302-21307, 2016. (IF= 3.84)